In the year 2012 CCR Technology GmbH in Troisdorf established it´s own PECVD Coating lab. This vertical two chamber coating system can handle large substrate sizes for process consulting & development up to 400x400 mm. The specific COPRA Plasmatechnology in it´s unique efficient excitation allows to make high quality PECVD coatings with high deposition rates in order to pass industrial coating levels. The performance and the way the COPRA ICP technology excite plasma makes it easy to scale up the process and the source itself to your industrial coating
Thin Film Technology: RF Power Delivery Troubleshooting Basics
RF power is commonly used to create a plasma for film deposition or chamber cleaning. The most common frequency is 13.56 MHz; but 30 kHz to 300 MHz (AC), and 2, 4, 27, 40, and 60 MHz are also employed. To go higher, thin film related applications most commonly jump to microwave at 2.7GHz.
RF can be challenging at any frequency; but at 13.56 or above it is particularly so. If you get a fault alarm or an indication there is something wrong, many users take the shortest time approach and replace the power supply, and/or the tuning network (a.k.a. "RF match" or "matching network"), assuming the problem lies with one or the other.
Annealsys AS-Micro Rapid Thermal Processing System
This economical 3 inch Rapid Thermal Processing System is great for laboratories and educational purposes. It contains a dual chamber to avoid cross contamination issues along with an optional glove box interface.
Applications of the AS-Micro Rapid Thermal Processing System
The AS-Micro can perform various rapid thermal annealing processses at atmospheric pressure or under vacuum:
Exploring Automated Single-Wafer Ashing of Compound Semiconductors
Ashing, in which the light–sensitive coating known as photoresist is removed and cleaned from an etched wafer, is one of the most important and frequently performed steps in chip fabrication. In this step, photoresist organics are “burned off” using a processing tool in which monatomic plasma is created by exposing oxygen or fluorine gas at low pressure to high–power radio waves. Previously, wafer ashing was largely done using batch–processing techniques to achieve the required throughput.
However, unlike silicon semiconductors, in which wafers are mass–produced in a standard 300–mm size, compound semiconductors are made of silicon carbide, gallium nitride, gallium arsenide, and sapphire, which can vary from 100 to 200 mm. When this is the case, significantly better uniformity of photoresist removal is required, which means better temperature and process controls. As a result, most compound semiconductor wafer
Hiden HPR-60 MBMS Analysis for Low Temperature Plasma (LTP) in Biomedical Engineering
Low Temperature Plasma (LTP) has emerged as a groundbreaking technology in the field of biomedical engineering, offering a wide range of applications such as sterilization, wound healing, infection prevention, cancer therapy, and tissue engineering. The precise analysis and characterization of LTP play a crucial role in understanding its complex properties. In this context, the Hiden HPR-60 MBMS system stands out as an invaluable tool for comprehensive analysis and assessment of LTP.
Advanced Sterilization and Disinfection
LTP has shown exceptional efficacy in sterilizing medical devices, including surgical instruments and catheters. By utilizing the Hiden HPR-60 MBMS system, researchers can gain insights into the composition, temperature, and reactivity of LTP, enabling the optimization of plasma parameters for efficient elimination of bacteria and viruses,
Semiconductor Device Fabrication: Key Processes and Challenges
In today’s digital age, semiconductors form the backbone of nearly every modern technology, from smartphones to supercomputers. The semiconductor device fabrication process drives this technological revolution, involving a series of specialized steps that demand precision, innovation, and advanced materials science.
However, despite the refinement of these processes, manufacturers face significant challenges in maintaining competitiveness. In the following sections, we’ll take a deep dive into the core processes of semiconductor device fabrication and explore the common challenges that industry leaders encounter while developing these essential components.
Understanding Semiconductor Device Fabrication: The Core Processes
The journey of creating a semiconductor device begins with semiconductor fabrication, a complex, multi-step process that transforms raw materials—typically silicon—into the intricate
With more than 300 systems installed in 44 countries, Annealsys is a leading manufacturer of RTP and CVD systems for research and production applications. A number of worldwide famous laboratories and production fabs are using Annealsys machines for the manufacturing and the development of future semiconductor photovoltaic and nanotechnologies components.
The Annealsys RTP furnaces allow performing annealing processes up to 2,642 degrees Fahrenheit (1,450 degrees Celsius) under different types of gases at atmosphere, or under reduced pressure.
Annealsys develops and manufactures direct liquid injection CVD and ALD systems, offering the highest versatility for process development. Their DLI
Navigating the Complex Power Needs of Current and Next Generation CT Systems
Computed Tomography (CT) is a computerized imaging technique used in radiology. A rapidly rotating X-ray beam and detector are used to generate cross-sectional images – so-called slices – that form the volumetric and very detailed internal image of the body.
The external (visible) components of a CT scanner are the gantry, which includes a control panel, setup lasers and the bore along which the patient couch will traverse during the scan. While the idea of this imaging technique is more than 100 years old, it wasn’t until the early 1970s that sufficient computing power became reality. And although CT is now a very well-established and widely used diagnostic tool, there are still a lot of physics and engineering R&D activities being undertaken to improve and extend capabilities.
Currently the state-of-the-art detectors used in CT are energy integrating detectors (EID) but it looks like that
Kalrez® was the first high performance perfluoroelastomer designed for plasma, high temperature, and wet process applications, and was introduced in the 1970s. Many users think of Kalrez® in a similar way we have all come to think of “Kleenex®” – that is – as a generic product and just about any type of Kalrez® will be OK. However, there are now many versions (“compounds”) of Kalrez® based on the intended application, and the differences are substantial.
Emmissivity Compensation and the Importance of Pyrometers
If you are measuring the temperature of a static surface, whether or not its temperature is changing, all is good. But what happens when you are changing the surface and its emissivity is also changing? Your pyrometer inaccuracy can increase substantially.
