Analysis and Metrology
Analysis and Metrology
Analysis and Metrology are a vital step in measurement your vacuum chamber during and after the deposition has occured. This includes gas analysis, thin film surface engineering, and metrology. IES represents companies such as Bruker Nano, and Hiden Analytical.
Gas Analysis is a process that track the amount of low levels of residual gas that remain in a vacuum chamber following pump down. This helps the end user track the amount of gas left during the cool down time.
Thin film processing in research, development and functionalisation of surfaces has a broad application range in microelectronics, nanotechnology, solar, flat panel, mechanics, optics, photonics, textiles, coatings, chemistry, biology and medicine.
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Types of Analysis and Metrology Equipment
Gas Analysis
Gas analysis is a piece of equipment that helps analyze the gasses being used in your application. These products use a sampling inlet to monitor the gas residuals. This helps the end user track the amount of gas left during the cool down time.
Thin Films Plasma and Surface Engineering
These devices help during the deposition process is a residual gas analyser configured for analysis of gases and vapours in vacuum processes and for vacuum diagnostics. The system is fully configurable for individual process applications such as CVD, plasma etching, MOCVD, process gas purity and in-process contaminant monitoring.
Metrology
Metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. Today, semiconductor manufacturing follows very strict standards and must accommodate very small dimensions.