The Annealsys Rapid Thermal Processing (RTP) systems are crucial tools in semiconductor manufacturing and materials science research. These systems are designed to quickly and precisely heat semiconductor wafers or substrates to high temperatures, typically ranging from hundreds to over a thousand degrees Celsius. RTP systems offer uniform heating across the substrate, enabling precise control over material deposition and annealing processes. They are widely used for depositing thin films through methods like chemical vapor deposition (CVD) and physical vapor deposition (PVD), as well as for annealing existing films to repair defects or activate dopants. RTP systems feature advanced control systems that allow for precise temperature profiles and atmospheric control within the processing chamber, making them indispensable for creating advanced semiconductor devices and conducting materials research.

Annealsys also provides Direct Liquid Injection Deposition systems. Direct Liquid Injection Deposition (DLID) systems are innovative tools used primarily in the fabrication of thin films and coatings. DLID systems operate by injecting liquid precursor solutions directly onto a substrate, which is then heated to evaporate the solvent and initiate chemical reactions, resulting in the deposition of a thin film. These systems offer advantages such as high material utilization efficiency, low waste generation, and the ability to deposit complex materials, including organic compounds, ceramics, and functional coatings. DLID systems are especially suited for applications in flexible electronics, organic electronics, and printed electronics due to their ability to deposit materials at low temperatures, making them compatible with various substrates, including plastics and flexible substrates.