Magnetron sputtering is a form of deposition technology that employs a gaseous plasma and kinetic energy to create a flux of ‘sputtered’ material used to coat surfaces under vacuum. The high-energy ions present in a magnetron sputtering plasma bombard the surface of the target (source material) and liberated atoms by the sputtering process to create this vapour cloud. The vapour moves through the vacuum area, depositing onto a substrate surface to create a thin film covering.
Standard Sputtering Processes
Standard sputter deposition processes (non-magnetically enhanced) involve a chamber evacuated to a high vacuum to decrease the partial pressure of background gases. Once the base pressure has been attained, a sputtering gas such as argon is introduced into the chamber and a pressure control system is employed to regulate the total pressure. [1]
A high negative voltage (-0.5 to -3 kV) is applied to the cathode
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Vacuum applications tend to be extremely high spec, with certain aspects being beyond compromise. Pumps and vessels must be of high integrity, with the ability to achieve the appropriate level of vacuum without leaks. In this article, we outline some of the key ways of measuring gas leak detection.
Why is Gas Leak Detection Important
Gas leak detection in pressurized and vacuum systems is a fundamental step in the manufacturing process. Maintaining and quantifying the leak tightness of vessels during service, is rarely prioritized which can have serious consequences.
Measurement of leaks is known as the leak rate, a number which is dependent on many factors from the pressure differential to the size of the holes. This rate refers to the amount of the leak that enters or leaves the enclosure per unit of time.
Gas leak detection is an important part of producing high quality products and ensuring quality control. There
