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DuPont™ Kalrez® 8085 for Semiconductor Processes

DuPont™ Kalrez® 8085 perfluoroelastomer parts are a beige, general purpose product for “select” etch, ash/strip and deposition processes. It has been formulated for minimal particle generation in NF3 plasma. Kalrez® 8085 exhibits very low particle generation and low weight loss in oxygen and fluorine-based plasmas, has excellent mechanical strength and is well-suited for both static and dynamic sealing applications (e.g., bonded slit valve doors, bonded gate valves, bonded pendulum valves, gas orifice seals, gas feedthrough seals, chamber lid seals, etc.) A maximum continuous service temperature of 240°C is suggested. Kalrez® 8085 can also withstand short-term excursions to 275 °C. Ultrapure post-cleaning and packaging is standard for all Kalrez® 8085 parts.

Performance Features of Kalrez® 8085

  • Very low particle generation in NF3 plasma
  • Excellent mechanical strength properties
  • Longer seal life
  • Reduced PM time and increased equipment uptime
  • Lower cost of ownership

Suggested Applications for Kalrez® 8085

  • Bonded slit valve door seals
  • Bonded gate valves
  • Chamber lid seals
  • Gas inlet seals
  • Gas orifice seals
  • Gas feedthrough seals

Fabs Choose Kalrez® 8085 for Improved Performance

Kalrez® 8085 has been reported to significantly improve wafer production in a variety of semiconductor plasma process applications where oxygen and fluorinated plasmas are used during the cleaning cycle.

In a number of evaluations at fabline customers, Kalrez® 8085 exhibited improved mechanical strength, lower particle generation and longer seal life compared to competitive perfluoroelastomer parts in both static and dynamic sealing applications.

Case Report #3137 — DuPont™ Kalrez® 8085 Reported to Reduce Particle Adders by 53% Over Competitive Perfluoroelastomer (FFKM A11)

  • HDPCVD O-ring
  • Process chemistry: Silane
  • Cleaning chemistry: NF3, O2 and O3
  • Competitive FFKM generated significantly more particle adders
Kalrez_8085_Case_Reports

Case Report #4115 — Kalrez® 8085 Extended Seal Life 100% versus Competitive Perfluoroelastomer (FFKM A18)

  • PECVD RPS cleaning module O-ring seals
  • Process chemistry: SiH4, O2
  • Cleaning chemistry: NF3
  • Competitive perfluoroelastomer failed due to severe plasma attack, i.e., erosion, cracking, etc.

Case Report #6553 — Kalrez® 8085 Improved Wafer Production over 25% versus Competitive Perfluoroelastomer (FFKM A2)

  • PECVD gas box, shower head and plate seal
  • Process chemistry: TEOS, O2 at 400 °C
  • Cleaning chemistry: NF3 plasma at 3500 watts
  • Competitive perfluoroelastomer failed due to cracking and excessive leakage

Case Report #2883 — Kalrezâ 8085 Extended Seal Life 100% versus Competitive Perfluoroelastomer (FFKM A2)

  • Ash isolation valve poppet seal
  • Process chemistry: O2, CF4
  • Cleaning chemistry: N/A
  • Competitive perfluoroelastomer failed due to cracking and excessive leakage