SiC Superjunction Implanter Solutions

In ion implantation in the semiconductor industry, ions are applied to and introduced into substrates such as wafers (doping, introduction of controlled defects, etc.) to achieve a targeted change in the properties of the base material and/or the already applied layers.

Adenso offers customized Implanter.Modules (IMP) as part of the modular VAC.ROBOTICS platform, enabling customers to easily and quickly build new end stations/implanter systems and apply and develop new ion implantation technologies.

For new ion implantation processes such as superjunction technologies for SiC (silicon carbide) MOSFETs up to 3.3 kV, Adenso's compact implanter modules, already proven in industrial series production, are ideally suited for high-volume manufacturing, especially in combination with the SubstrateScanner solutions for precise scanning movements of the SiC substrates/wafers in the ion beam. A unique selling point is the availability of Adenso's