Maintaining a cluster tool can be difficult. As an example take an 8 port configuration with 7 process modules and a loadlock. In more cases is most definitely a challenge.
Why is that?
The reasons are usually as follows:
A desire to make maximum use of the floor space
The need for fixed piping for the process gasses
The use of a rigid mainframe without adequate service access
What can be done about it?
Process technology is clearly the top priority. Substrate handling is of secondary importance. This line of reasoning already dictates the solution: Using a flexible, central robot Wafer Handling Module that allows access for maintenance work simply by removing a loadlock module – without having to disconnect the media connections.
Sounds fantastic? It is. And it gets even better:
Using a semi-automatic docking solution called adDOCK makes it very easy to uncouple and move
Substrates are getting thinner and thinner – and customer + process requirements are increasing rapidly. Be prepared with Adenso’s UTH solutions – UltraThin wafer/substrate Handling, based on the VAC.ROBOTICS platform, which allows you to use all the familiar features (ATM+VAC):
UltraThin substrate allows you to use all the familiar features:
In ion implantation in the semiconductor industry, ions are applied to and introduced into substrates such as wafers (doping, introduction of controlled defects, etc.) to achieve a targeted change in the properties of the base material and/or the already applied layers.
Adenso offers customized Implanter.Modules (IMP) as part of the modular VAC.ROBOTICS platform, enabling customers to easily and quickly build new end stations/implanter systems and apply and develop new ion implantation technologies.
For new ion implantation processes such as superjunction technologies for SiC (silicon carbide) MOSFETs up to 3.3 kV, Adenso's compact implanter modules, already proven in industrial series production, are ideally suited for high-volume manufacturing, especially in combination with the SubstrateScanner solutions for precise scanning movements of the SiC substrates/wafers in the ion beam. A unique selling point is the availability of Adenso's
The WHM WaferHandling Module, developed by Adenso, features a central vacuum chamber and an integrated WHR WaferHandling Robot, optimized for handling substrates/carriers in high vacuum. Our WHM WaferHandling Module operates completely autonomously, is space-saving, and can be easily docked to your existing process stations – your vacuum cluster system is ready to use!
WHR WaferHandling.Robot – the basis for handling and automation
The WHR wafer handling robot is the core of Adenso's modular VAC.ROBOTICS platform. The Adenso WHR handles sensitive and large-area substrates in the field of vacuum robotics (industrial vacbot) and is optimized for maximum payload and long reach. Its simple arm geometry allows for small gate valves and compact handling swivel ranges.
Your advantages at a glance:
REACH: Largest travel distances – maximum flexibility
