UltraThin substrate Handling
Substrates are getting thinner and thinner – and customer + process requirements are increasing rapidly.
Be prepared with Adenso’s UTH solutions – UltraThin wafer/substrate Handling, based on the VAC.ROBOTICS platform, which allows you to use all the familiar features (ATM+VAC):
UltraThin substrate allows you to use all the familiar features:
- align
- flip
- bond
- heat
- ATM and VAC versions available.
Your Benefits
- Easy integration into the Adenso VAC.ROBOTICS platform
- Time savings through process optimization
- Process control using Adenso Cluster Software.Solution adControl
- align - center position and angle
- flip - turning substrates over inside vacuum enviroment
- combine - wafer/wafer or wafer/carrier
- heat - conditioning and annealing
Contact IES to learn more about Adenso solutions.