Blog

  1. Vacuum Technology: How to Choose the Right High Vacuum Isolation Valve, Part 2 of 3

    Valve design plays a huge role in the functioning of a vacuum system, and many factors need to be considered. This 3 part blog will discuss each type so you can choose the best one for your application.

    • Leak rate
    • Conductance
    • Application compatibility
    • Expected service life
    • Ease of maintenance
    • Size
    • Price

    Ball valves, poppet valves, and gate valves all have strengths and weaknesses when it comes to these different factors; this will guide you through each type so you can choose the best one for your application

    Poppet Valves

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  2. Vacuum Technology: How to Choose the Right High Vacuum Isolation Valve, Part 1 of 3

    Valve design plays a huge role in the functioning of a vacuum system, and many factors need to be considered. This 3 part blog will discuss each type so you can choose the best one for your application.

    • Leak rate
    • Conductance
    • Application compatibility
    • Expected service life
    • Ease of maintenance
    • Size
    • Price

    Ball valves, poppet valves, and gate valves all have strengths and weaknesses when it comes to these different factors; this will guide you through each type so you can choose the best one for your application.

    Ball Valves

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  3. Vacuum Technology: Why Use a Conical v. Straight Reducer? Conductance.

    This is a re-post of a "Tech Talk" Article originally posted by Garrett Hanrahan of ANCORP.

    What advantage does a conical reducer offer
    compared to a similarly flanged straight reducer? The answer is simple:
    Conductance!

    Over the same length, a conical reducer has a larger mean diameter than a straight reducer with the same flange terminations. As illustrated by the equation for conductance (C) below, diameter (D) has a third-order effect on conductance. So, if you want to increase conductance, increasing diameter is the best place to start. Reducing length (L) helps as well,

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  4. Vacuum Technology: To EP or Not to EP?

    This is a Re-Post of Blog article by Garrett Hanrahan of ANCORP

    Before you determine whether or not to specify
    an EP (electropolish) finish on a custom-fabricated vacuum component or chamber,
    it helps to know what electropolishing can and cannot do for you in the context
    of your vacuum application.

    5 = pre EP, 6 = post EP

    What EP Can Do

    Enhance Component Cleanliness

    The concentrated acidic solution baths used in
    EP thoroughly clean a component

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  5. Vacuum Technology: Extending Cryopump Life

    Cryopumps are an excellent choice for certain high vacuum applications, particularly when pumping water vapor is a key requirement. A cryopump package consists of a vacuum section (cold head), and a close cycle helium section (compressor).

    Routine replacement of consumable components in your closed cycle helium system is essential to maintaining optimal performance. The sole purpose of the adsorber in your helium compressor is to trap oil vapor before it enters the pump. Without a fully functioning adsorber, oil tends to condense in the closed helium circuit, which results in oil deposits around seals and displacers. Should this occur, it limits the ability of your cryopump to achieve the low temperatures necessary to run your process at optimal levels.

    Adsorbers are filled with a proprietary sorbent material used to trap the excess oil vapor as helium passes

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  6. What is TPO and Why is it Performed?

    Temperature Programmed Oxidation (TPO) is an analytical technique capable of characterizing catalysts and is an important consideration for research and development.

    The performance of TPO requires a furnace or microreactor capable of increasing temperatures of a catalyst in precise increments up to extreme conditions, for example in brackets of 1-20°C min-1 up to 1000°C. An integrated mass spectrometer allows for constant real-time analysis of catalytic activity throughout a given thermal reaction, in which a gas mixture will flow over a catalyst throughout an incrementally programmed temperature rise.

    Hiden Analytical -TPO

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  7. What is TPR and How is it Performed?

    Temperature programmed reduction (TPR) is a material characterization process commonly used in catalysis studies to examine the surface chemistry of metals and metal oxides under varying thermal conditions. TPR-enabled mass spectrometry equipment can acquire quantitative and qualitative data relating to the reducing gas mixtures that are made to flow over metallic samples. This process is integral to catalyst investigation as it provides accurate insights into catalyst reducibility and reaction rates in the presence of metal surfaces, informing conclusions on catalyst reproducibility and supporting quality control of existing catalytic substances by setting benchmarks or reduction profiles that ideal manufactured catalysts should adhere to.

    TPR
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  8. New Products and Services: Thermal Technology

    [ Posted 2020-07 ]
    Watlow’s PM PLUS™, the enhanced EZ-ZONE® PM, is now more intuitive and features an enhanced interface for easier programming and readability with a SMOOTH-TOUCH™ keypad creating an industry leading user experience. The PM PLUS is backwards compatible with legacy EZ-ZONE PM controllers but offers many user upgrades including an intuitive menu flow allowing the controller to be easily configured. It also continues to offer the industry leading Bluetooth® connectivity with the EZ-LINK™ mobile app for remote access capability and full descriptions of parameters and error codes. The PM PLUS improves the user experience by reducing the complexity at the front of the control while eliminating the dependency of cables when configuring the product.
    More information Contact Us

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  9. What is Surface Interface Analysis?

    What is Surface Interface Analysis

    This is a re-post of an article published by Hiden Analytical of Warrington, England.

    In materials science, a surface interface refers to the boundary region between air or a vacuum and physical media. The atomic composition and topography of a solid’s surface monolayer can determine many of the chemical-mechanical characteristics of the bulk material, including solid—gas interfaces such as adsorption and permeation. Reaction kinetics of catalysts and the electromechanical performance of semiconducting materials for thin film fabrication are both affected by surface interface phenomena.

    Modern surface engineers consider surface interface analysis a critical stage of development and process control. This article will explore how surface interface analysis is performed in more detail, while highlighting some of its critical applications:

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  10. New Products and Services: High Vacuum Technology

    ANCORP:

    [ Posted 2021-09 ]
    ANCORP has added 316LN ConFlat flanges to their already wide product offering. Standard CF flange types (blanks, fixed, rotatable, tapped) from 1.33” to 10.00” OD are available separately or for use as subcomponents in configured and custom fab products. 316LN is a nitrogen-enhanced version of 316L stainless steel. It is harder and has lower magnetic content than 316L. These flanges are ideal for UHV applications where low magnetic permeability is required, e.g., beamlines, sensitive instrumentation, gauges, feedthroughs, etc.
    Finding 316LN CF flanges on ancorp.com: Go to Products > CF and Wire Seal Flanges and Fittings > Conflat (CF) Flanges > 316LN

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