WFM WaferFlip.Module
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The Adenso WFM WaferFlip.Modules enable wafers to be turned over within the vacuum environment to process the back of the wafer.
PERFORMANCE & SPECIFICATIONS
- Benefits
- Turning wafers under vacuum
- Reliable solution for the processing from below
- Reduction of particle contamination
- Saves additional system equipment and cleanroom space and thus additional costs
- Time saving due to the connection of multiple processes within a system
- Technical Sheets