ALM AutoLoad.Modules

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The Adenso ALM 230X AutoLoad.Modules close the process gap between manual loading solutions and fully automated WaferHandling.Robot systems. Fast, streamlined, independent, suitable for high-vacuum and cleanroom.

PERFORMANCE & SPECIFICATIONS

 
  • Benefits
    • Process reliability: high-precision and space-saving kinematics, Substrate.Mapping, ID reader for magazine identification
    • Flexibility: customised integration of different test devices, image processing systems, substrate alignment of different cassette types
    • Suitable for substrates up to 200 mm, round and square type
    • ToolCloud: The Adenso.ToolCloud manages and monitors all Adenso.Solutions from the start of the project through to actual production