Implanter.Module
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The WHM-IMP.Module is designed for substrate dimensions of up to 300 or 200mm, on which wafer sizes of 150/100/75/50/25mm can also be processed. Direct substrate handling as well as carrier solutions are available for all substrate sizes and dimensions (round, rectangular, special)
PERFORMANCE & SPECIFICATIONS
- Benefits
- flexible, customer-specific configuration, based on industrial-prooved solutions
- fast commissioning based on modular hardware and software concept
- integration of customers ion implantation technologies and measurement equipment