The CCR Technology COPRA DN250 Round Plasma Sources are flange mounted round RF-ICP source solutions for substrate sizes of up to 6". Those sources are designed to be used both for Research and Development in the field of Plasma Surface Science as also in particular for activation and etching applications and oxidation/nitridation processes. The higher degree of customization properties the COPRA DN250 Round Plasma Source series carry with enable PECVD or Etching processes with the freedom of use of any gas type and and are crucial for customization needs in industrial production set ups. Highest plasma densities in combination with dissociation degrees of up to 90% will get most of your low pressure plasma applications to a new qualitative level as the ease of generation of atomic species the CCR COPRA technology provides will make your plasma coating/etching processes highly reactive. The COPRA plasma source solutions are scalable. In many cases the process developments made with our smaller source solutions are being transferred on substrates of larger dimensions by using the COPRA plasma sources for larger substrate sizes which are completing our RF-ICP plasma source solution portfolio.