The CCR Technology COPRA DN201 Round Plasma Sources are designed to be used for Research and Development in the field of Plasma Surface Science on small substrates of up to 3" wafer size. High plasma densities in combination with dissociation degrees of up to 90% enable accurate activation/cleaning and etching as also post oxidation/nitridation of PVD processes. Those COPRA DN201 Round Plasma Sources are also enabling basic PECVD processes. The result achieved by the COPRA DN201 Round Plasma Sources are transferable on larger substrate dimensions by using another type of our COPRA plasma sources for larger substrate sizes. The COPRA DN201 Round Plasma Source is the ideal partner for R&D labs and small productions, as this source can be used for a variety of applications from surface activation to PECVD to etching applications. The COPRA DN201 Round Plasma Source is available in both manual and remote controlled versions.