An Equipment Front End Module (EFEM), a mainstay of semiconductor automation, transports product (silicon wafers or quartz photomasks) between ultra-clean storage carriers and a variety of processing, measurement, and testing systems. The EFEM contains the key components needed to unload product, deliver it to the parent tool for processing and return the product to its carrier upon completion. The DLP-300 EFEM is designed to be used with an existing OEM GEM base system and can be configured to handle a variety of wafers sizes from a maximum of 2 load ports to 2 load locks. In addition, Angled Transfer Chambers or process modules connect directly to the rear of the DLP-300.