The Bruker Optic ContourSP Large Panel Metrology System doubles the measurement throughput of high-density interconnect PCB (HDI-PCB) substrates over previous-generation WLI instruments. The system is specifically designed to measure each layer of the PCB panels during manufacturing, and incorporates a host of advanced features that deliver utmost production performance, convenience, reliability, and throughput for the semiconductor packaging industry. The gauge-capable ContourSP utilizes an intuitive production interface that offers fast and easy fiducial alignment with configurable user input.